Posts Tagged ‘ white paper ’

How to Design Rapid-Start Power Systems

March 20, 2018
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How to Design Rapid-Start Power Systems

The time to power-up a system is a critical metric for many applications, particularly as engineers increasingly use stop/start technology to save power

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White Paper Explains How to Avoid Hidden Costs when Developing Power Systems

March 8, 2018
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White Paper Explains How to Avoid Hidden Costs when Developing Power Systems

It’s not uncommon for power design projects to encounter cost and time overruns during the development phase.

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Lack of Resources Holds Back Power System Projects

September 11, 2017
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Lack of Resources Holds Back Power System Projects

Our white paper, Lack of Resources and Skills Hamper Successful Delivery of Power System Projects, describes some of the biggest challenges faced by power designers trying to meet project schedules and cost targets.

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White Paper Explains How to Meet MIL Specifications and Solve SWaP-C Challenges

July 19, 2017
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White Paper Explains How to Meet MIL Specifications and Solve SWaP-C Challenges

Defense applications with 270VDC input must meet stringent EMI, environmental, and power-related standards, a challenge that is further complicated by SWaP-C requirements.

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White Paper Explains How to Meet Power Demands of Modern Automotive Systems

June 26, 2017
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White Paper Explains How to Meet Power Demands of Modern Automotive Systems

Download this new white paper to learn how power components can be used to meet the demands of complex modern automotive applications.

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Changing Project Requirements are Keeping Power Engineers Awake at Night

April 19, 2017
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Changing Project Requirements are Keeping Power Engineers Awake at Night

Power designers face many technical challenges to meet the demand to provide more power from less space and with higher efficiencies. Despite the difficulty of overcoming these demands

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Thermal Management of VIA and ChiP Products

April 4, 2017
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Thermal Management of VIA and ChiP Products

High performance power components require packaging technology that is thermally adept to allow for heat to be removed easily. Our VIA and ChiP products both offer outstanding thermal performance

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