Posts Tagged ‘ VIA ’

High Power Density AC-DC Front-Ends Made Easy with the New PFM in VIA Packaging Technology

May 18, 2015
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High Power Density AC-DC Front-Ends Made Easy with the New PFM in VIA Packaging Technology

Today Vicor announced PFMs in VIA packaging technology, front-end power components that provide a PFC regulated 24 V or 48 V SELV DC output from a universal AC input.

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Marco Panizza Describes the Vicor HVDC Demonstration at electronica 2014

January 5, 2015
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Power Systems Design is featuring a video presentation presented by Marco Panizza, Vicor’s European application engineering manager, of a high voltage DC (HVDC) power distribution system from electronica 2014.

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Embedded News Discusses the Benefits of the Power Component Design Methodology with Claudio Tuozzolo

November 29, 2014
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During the recent electronica trade show, Carolina Kleinken-Palma, editor of Embedded-News.tv, interviewed Claudio Tuozzolo, president of Vicor’s Picor division about the benefits of Vicor’s power component design methodology. In the video, Claudio explains how the modular and scalable approach enables power system designers to develop high-performance solutions for a wide range of applications. He gives an example of a system that uses a product based on the VIA packaging technology that was unveiled at the show to produce a 48 V hub voltage. This hub voltage can be directly converted to voltages as low...

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