Posts Tagged ‘ VIA ’

Addressing the Trends in Power Design with the Power Component Design Methodology

September 18, 2015
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Addressing the Trends in Power Design with the Power Component Design Methodology

Power distribution and management are now crucial elements of many different electrical systems, from electric vehicles to data centers. When designing power systems, engineers need to optimize efficiency

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Power Supply Thermal Issues are More Important than Ever

August 24, 2015
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Power Supply Thermal Issues are More Important than Ever

It’s an old engineering story, sometimes told in jest, but often not: the power supply is the last item specified. “We’ll just have to find a supply that fits

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7 Ways to Shrink Your Power System

July 23, 2015
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Distribution of power is obviously a critical element of any electronic system. Simply getting the power to the load, however, is only a part of the story: in addition to optimizing efficiency, other constraints include reducing EMI

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EPDT Explains how PFM in the VIA Package Helps Engineers Meet Key Design Metrics

July 6, 2015
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EPDT Explains how PFM in the VIA Package Helps Engineers Meet Key Design Metrics

EPDT recently published an article by Robert Russell, vice president of product marketing at Vicor, that explains how the PFM in VIA packaging technology allows engineers to use the Power Component Design Methodology

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The Most Popular New Blog Posts This Year

July 1, 2015
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Whenever we’ve looked at the most popular Powerblog posts, technical stories such as the Back to Basics series were high up on the Top 10 list.

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Claudio Tuozzolo Describes PFM in the VIA Package in Power Systems Design Video

June 4, 2015
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Claudio Tuozzolo Describes PFM in the VIA Package in Power Systems Design Video

During PCIM 2015, Alix Paltre, editorial director at Power Systems Design talked to Claudio Tuozzolo, president of Vicor’s Picor division about the PFM in VIA packaging technology.

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New BCM Enables Efficient HVDC Power Systems

May 19, 2015
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New BCM Enables Efficient HVDC Power Systems

Today we announced our new BCM DC-DC Front-End Module in VIA packaging technology, which generates an isolated safety extra-low voltage (SELV) rail from a High Voltage DC (HVDC) supply.

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