Posts Tagged ‘ VIA ’

“Wrapping” Power

“Wrapping” Power

Often getting power to fit your system’s electrical requirements is not the challenging part of the design.

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Five new MIL-COTS Power Components

June 14, 2017
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Five new MIL-COTS Power Components

Today we announced four new MIL-COTS (M-Grade) DC-DC Converter Modules (DCMs) and a new MFM Filter.

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New MIL-COTS DCMs and Input Filters Meet Advanced SWaP-C Requirements

May 2, 2017
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New MIL-COTS DCMs and Input Filters Meet Advanced SWaP-C Requirements

Today we announced two new MIL-COTS (M-Grade) DC-DC Converter Modules (DCMs) in VIA packaging, with 270V (160 – 420V) input voltage range

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Thermal Management of VIA and ChiP Products

April 4, 2017
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Thermal Management of VIA and ChiP Products

High performance power components require packaging technology that is thermally adept to allow for heat to be removed easily. Our VIA and ChiP products both offer outstanding thermal performance

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DC-DC Converter Range Extended with Two New DCMs in a ChiP Package

February 16, 2017
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DC-DC Converter Range Extended with Two New DCMs in a ChiP Package

Following on from the introduction of new DCMs in VIA packages earlier this month, today we announced two new DCMs in a ChiP package.

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The Most Popular Blog Posts in 2016

December 20, 2016
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What were the most important topics for power developers in 2016? To find out, we’ve put together a league table of the 10 most popular posts on the PowerBlog

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EDN Names DCMs in VIA Package One of the Hot 100 Products of 2016

December 16, 2016
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EDN Names DCMs in VIA Package One of the Hot 100 Products of 2016

We’re delighted that the readers and editors of EDN have selected our DCM DC-DC converters in VIA packages and PowerBench Power System Designer

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