Posts Tagged ‘ Thermal ’

Enabling Higher Performance Power Components with Packaging Innovations

July 15, 2014
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Enabling Higher Performance Power Components with Packaging Innovations

This is the first in a series of three blog posts written by Doug Ping, Principal Application Engineer at Vicor, which explain how packaging innovations play a critical role in the improvement of power system performance.

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Doug Ping Discusses the Importance of Packaging in Power Systems Design

March 13, 2014
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Doug Ping Discusses the Importance of Packaging in Power Systems Design

The March 2014 issue of Power Systems Design (PSD) North America features an article by Doug Ping that discusses the importance of packaging and thermo-mechanical design for power components.

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White Paper: Optimize Thermal Management of ChiP Products

March 4, 2014
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White Paper: Optimize Thermal Management of ChiP Products

The ChiP Platform provides a dramatic improvement in thermal management, allowing cooling through both the top and bottom sides of the package, as well as the leads. The thermal performance of this new packaging technology helps power system designers keep pace with the demands to increase power density at a greater rate than improvements in converter efficiency.

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Power Electronics Europe Features the Thermal Performance of Vicor’s ChiP Technology

November 6, 2013
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Power Electronics Europe Features the Thermal Performance of Vicor’s ChiP Technology

No matter how efficiently your subsystem delivers energy, the residual dissipation and your ability to remove heat from the system limits power density. Waste energy, in the form of heat, is the enemy of power system designers. Although converter technology continues to increase efficiency, particularly components based upon Vicor’s Sine Amplitude Converter (SAC), there will always be some waste heat that needs to be removed. Power Electronics Europe features an article by Gary Gill, Vicor’s Director V.I Chip Product Line, which defines the problem, explaining that heat is typically the factor that limits power...

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Thermal Management for Picor Cool-Power Isolated DC-DC Converters

May 4, 2012
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Thermal Management for Picor Cool-Power Isolated DC-DC Converters

This is the second in a three-part series that discusses thermal management issues, and how to address them for different product types.

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Thermal Considerations for High Power Density DC-DC Bricks

March 30, 2012
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Thermal Considerations for High Power Density DC-DC Bricks

As DC-DC converters continually increase in power density, careful thermal management is essential to maximise their usable power. Efficiency, although important, is not the only factor. Removal of dissipated heat is also essential, because product reliability and operational life relate inversely to operating temperature. Therefore, robust power system design calls for thermal management that effectively handles load and environmental demands in practice as well as in theory. A converter’s conversion efficiency is the ratio between output and input power. This efficiency depends on its operating parameters, particularly input voltage and output current as well...

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