Posts Tagged ‘ Thermal ’

Thermal Design in the Age of Double-Sided Component Cooling

July 10, 2018
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Thermal Design in the Age of Double-Sided Component Cooling

Power system thermal issues are perhaps more important than ever: the need for greater energy efficiency, higher output power and increased density must be met despite reducing design cycle times to meet challenging time-to-market

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PowerBench Thermal Simulation Includes Cold-Wall Cooling

June 11, 2018
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PowerBench Thermal Simulation Includes Cold-Wall Cooling

Vicor offers powerful simulation tools in the PowerBench online suite that address both thermal and electrical performance. Our applications engineers often find that customers aren’t aware of some of the capabilities of the tools

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Thermal Management of VIA and ChiP Products

April 4, 2017
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Thermal Management of VIA and ChiP Products

High performance power components require packaging technology that is thermally adept to allow for heat to be removed easily. Our VIA and ChiP products both offer outstanding thermal performance

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White Paper Describes Thermal Circuit Models of Vicor Power Components

November 30, 2016
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White Paper Describes Thermal Circuit Models of Vicor Power Components

Thermal Circuit Models are tools for making thermal calculations that are analogous to electrical circuits.

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Whitepaper: How to Use Circuit Models in Thermal Calculations

November 24, 2016
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Whitepaper: How to Use Circuit Models in Thermal Calculations

Thermal design is one of the most challenging elements of power system development. System requirements demand more power from less space

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On-Demand Webinar Explains Thermal Simulation

November 10, 2016
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On-Demand Webinar Explains Thermal Simulation

With requirements for power systems, for example power density, becoming more and more challenging, good thermal design is essential if power engineers are to meet their goals.

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Thermal Webinar Shows How PowerBench Simulation Tools Make Your Design Cooler

October 5, 2016
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Thermal Webinar Shows How PowerBench Simulation Tools Make Your Design Cooler

As modern electronic systems demand more and more power, power component density increases, the removal of heat is one of the biggest challenges faced by power developers.

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