Posts Tagged ‘ Power on Package ’

Electronic Products Award for our Power-on-Package Solution

January 10, 2018
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Electronic Products Award for our Power-on-Package Solution

We are honored to have received an Electronic Products’ Product of the Year award for our Power-on-Package modular current multipliers (MCM), which represents yet more recognition for this revolutionary technology.

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Power-on-Package Enables High Efficiency in Gyoukou Supercomputer

November 17, 2017
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Power-on-Package Enables High Efficiency in Gyoukou Supercomputer

At SC17 this week, ExaScaler and PEZY Computing unveiled their Gyoukou supercomputer, which uses our innovative Power-on-Package technology.

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Eliminating the Last Inch with Power on Package

November 7, 2017
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Eliminating the Last Inch with Power on Package

We recently announced our new Power on Package technology that enables manufacturers of CPUs, GPUs and ASICs (XPUs) to place power components either on the substrate of their device (on package) or extremely close to the XPU socket. Eliminating the “last inch” between the regulator and the XPU makes possible the level of higher performance required for today’s most demanding applications. The Need for Higher XPU Performance The demand for higher performance computing and communications systems is being driven by applications such as the analysis of big data, video rendering and artificial intelligence (for...

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Power-on-Package: Enabling Higher Performance in Artificial Intelligence Applications

August 22, 2017
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Power-on-Package: Enabling Higher Performance in Artificial Intelligence Applications

Artificial intelligence, machine learning, big data mining and other demanding applications are driving CPU/GPU/ASIC (“XPU”) processor operating currents to hundreds of Amperes.

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