Posts Tagged ‘ Power on Package ’

NVIDIA HGX-2 Cloud-Server Platform Introduced at 2018 GTC Taiwan

NVIDIA HGX-2 Cloud-Server Platform Introduced at 2018 GTC Taiwan

The Vicor team was present at GTC Taiwan and witnessed the release of the new NVIDIA HGX-2 cloud server platform. The HGX-2 is targeted for hyperscale and HPC deployments

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Electronic Specifier Discusses the Importance of Power Packaging

June 5, 2018
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Electronic Specifier Discusses the Importance of Power Packaging

Electronic Specifier has recently published a couple of articles about the importance of packaging in power system design, focusing on the Vicor Power-on-Package technology.

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Robert Gendron Explains Why Power Matters in AI Applications

June 4, 2018
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Robert Gendron Explains Why Power Matters in AI Applications

Robert Gendron, Corporate VP at Vicor, recently spoke to Richard Nass, the Executive Vice-President of OpenSystems Media, to discuss why power systems are so important in AI applications

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World’s Most Powerful Artificial Intelligence Systems Announced at GTC 2018

World’s Most Powerful Artificial Intelligence Systems Announced at GTC 2018

At GTC 2018, the Vicor team was on hand to watch the announcement of the NVIDIA DGX-2, presented as the most powerful AI system to date

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New 12V – 48V NBM Simplifies Move to 48V Power Distribution

March 27, 2018
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New 12V – 48V NBM Simplifies Move to 48V Power Distribution

We announced a new Non-Isolated Bus Converter Module (NBM) that converts 12V to 48V

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Join Vicor at the GPU Technology Conference #GTC18

March 15, 2018
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Join Vicor at the GPU Technology Conference #GTC18

Join us at GTC 2018, the premier AI and deep learning conference, March 26-29 in Silicon Valley. Vicor will be demonstrating its latest Power-on-Package solutions supporting the power needs of CPUs and GPUs for Artificial Intelligence (AI).

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Vicor and 3M Demonstrate the Benefits of Liquid Immersion Cooling at OCP Summit

March 14, 2018
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Vicor and 3M Demonstrate the Benefits of Liquid Immersion Cooling at OCP Summit

Vicor will partner with 3M to demonstrate this advanced datacenter cooling technique and its benefits at Open Compute Project Summit 2018.

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