Posts Tagged ‘ Power on Package ’

World’s Most Powerful Artificial Intelligence Systems Announced at GTC 2018

World’s Most Powerful Artificial Intelligence Systems Announced at GTC 2018

At GTC 2018, the Vicor team was on hand to watch the announcement of the NVIDIA DGX-2, presented as the most powerful AI system to date

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New 12V – 48V NBM Simplifies Move to 48V Power Distribution

March 27, 2018
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New 12V – 48V NBM Simplifies Move to 48V Power Distribution

We announced a new Non-Isolated Bus Converter Module (NBM) that converts 12V to 48V

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Join Vicor at the GPU Technology Conference #GTC18

March 15, 2018
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Join Vicor at the GPU Technology Conference #GTC18

Join us at GTC 2018, the premier AI and deep learning conference, March 26-29 in Silicon Valley. Vicor will be demonstrating its latest Power-on-Package solutions supporting the power needs of CPUs and GPUs for Artificial Intelligence (AI).

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Vicor and 3M Demonstrate the Benefits of Liquid Immersion Cooling at OCP Summit

March 14, 2018
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Vicor and 3M Demonstrate the Benefits of Liquid Immersion Cooling at OCP Summit

Vicor will partner with 3M to demonstrate this advanced datacenter cooling technique and its benefits at Open Compute Project Summit 2018.

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Vicor Demonstrates Latest Power-on-Package Solution

March 14, 2018
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Vicor Demonstrates Latest Power-on-Package Solution

We recently announced the newest Power-on-Package 1,000A ChiP set for high performance CPUs and GPUs, and will be demonstrating it at two upcoming events

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Artificial Intelligence Requires a Fresh Look at Power Optimization

March 7, 2018
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Artificial Intelligence Requires a Fresh Look at Power Optimization

The huge gains in processing performance achieved in recent years have begun to unlock the vast potential of artificial intelligence (AI), propelling it from nascent technology enabling image and speech recognition applications

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New Power-on-Package MCM Can Deliver Peak Currents of up to 1000A

March 6, 2018
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New Power-on-Package MCM Can Deliver Peak Currents of up to 1000A

Power-on-Package (PoP) is a new approach that overcomes the obstacles associated with delivering high currents to CPUs or GPUs (or simply XPUs) through the “last inch”.

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