Posts Tagged ‘ power density ’

Stephen Oliver Describes the Challenges Faced by Power System Designers

November 25, 2014
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Stephen Oliver Describes the Challenges Faced by Power System Designers

During the recent electronica show we were able to discuss a range of topics with Stephen Oliver, VP Marketing & Sales of our VI Chip division

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White Paper: Optimize Thermal Management of ChiP Products

March 4, 2014
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White Paper: Optimize Thermal Management of ChiP Products

The ChiP Platform provides a dramatic improvement in thermal management, allowing cooling through both the top and bottom sides of the package, as well as the leads. The thermal performance of this new packaging technology helps power system designers keep pace with the demands to increase power density at a greater rate than improvements in converter efficiency.

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What’s in Store for Power Designers in 2014?

January 22, 2014
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What’s in Store for Power Designers in 2014?

Power Electronics has featured the views of Gary Gill, director of our VI Chip product line, in their Power Electronics 2014 Forecast. Gary considers the challenges of removing heat in power systems, highlighting the benefit of using multiple surfaces for cooling. Most systems take a simple approach to thermal design, cooling through the top surface. In 2014, and beyond, application requirements will demand higher power densities, so requiring thermal design approaches that are more sophisticated than simple topside cooling. Read Gary’s piece to see how new power packaging technologies and materials, such as those...

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‘Paultre on Power’ Features Gary Gill Explaining How To Increase Board-Level Power Density

January 22, 2014
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‘Paultre on Power’ Features Gary Gill Explaining How To Increase Board-Level Power Density

Gary Gill, Director of Vicor’s VI Chip product line, was recently interviewed by Alix Paultre of Power Systems Design. In this podcast episode, Gary discussed the challenges of increasing power density at the board level, explaining how Vicor power components help engineers design products with higher system efficiency, improved thermal management and higher functionality in smaller form factors.

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Vicor helps Stanford Solar Car Project Cross the Australian Outback

November 4, 2013
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Vicor helps Stanford Solar Car Project Cross the Australian Outback

Stanford University students have been competing in solar car races for two decades, and this year they achieved their best results ever, thanks in part to Vicor power components.

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There’s nothing easy in power design!

September 19, 2013
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Vicor spends a lot of time trying to understand the challenges faced by our customers and working out the biggest issues power designers must overcome. The logic is simple: if we can solve the problems, everyone is going to be successful.

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Designing Power Distribution Networks for Automated Test Equipment

January 3, 2013
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The demands on power architectures designed for automated test equipment (ATE) applications have increased dramatically as these systems become more complex. Only a few years ago, many ATE systems used simple “silver box” supplies, but this is no longer a sustainable approach. Modern ATE circuitry requires more power to operate, whilst voltage and current requirements span a wide range. At the same time, these power systems need to accurately and quickly modulate various voltage rails in order to completely characterize the performance of a device under test (DUT). The power system has therefore become...

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