Posts Tagged ‘ packaging technology ’

“Wrapping” Power

“Wrapping” Power

Often getting power to fit your system’s electrical requirements is not the challenging part of the design.

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The PFM and AIM Meet Height Constraints of PBX Application

May 27, 2016
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The PFM and AIM Meet Height Constraints of PBX Application

The PowerBlog has covered the benefits of the low profile packaging we offer for our range of power components, and recently they came to the rescue of a customer

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Power Supply Thermal Issues are More Important than Ever

August 24, 2015
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Power Supply Thermal Issues are More Important than Ever

It’s an old engineering story, sometimes told in jest, but often not: the power supply is the last item specified. “We’ll just have to find a supply that fits

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Packaging Innovations – Doubling the Surface Area for Cooling

July 29, 2014
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Packaging Innovations – Doubling the Surface Area for Cooling

This is the final blog post in a series of three written by Doug Ping, Principal Application Engineer at Vicor, which explain how packaging innovations play a critical role in the improvement of power system performance.

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Packaging Innovations: As Slick as a Brick

July 22, 2014
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Packaging Innovations: As Slick as a Brick

This is the second in a series of three blog posts written by Doug Ping, Principal Application Engineer at Vicor, which explain how packaging innovations play a critical role in the improvement of power system performance.

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Enabling Higher Performance Power Components with Packaging Innovations

July 15, 2014
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Enabling Higher Performance Power Components with Packaging Innovations

This is the first in a series of three blog posts written by Doug Ping, Principal Application Engineer at Vicor, which explain how packaging innovations play a critical role in the improvement of power system performance.

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Doug Ping Discusses the Importance of Packaging in Power Systems Design

March 13, 2014
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Doug Ping Discusses the Importance of Packaging in Power Systems Design

The March 2014 issue of Power Systems Design (PSD) North America features an article by Doug Ping that discusses the importance of packaging and thermo-mechanical design for power components.

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