Posts Tagged ‘ MCM ’

Eliminating the Last Inch with Power on Package

November 7, 2017
By
Eliminating the Last Inch with Power on Package

We recently announced our new Power on Package technology that enables manufacturers of CPUs, GPUs and ASICs (XPUs) to place power components either on the substrate of their device (on package) or extremely close to the XPU socket. Eliminating the “last inch” between the regulator and the XPU makes possible the level of higher performance required for today’s most demanding applications. The Need for Higher XPU Performance The demand for higher performance computing and communications systems is being driven by applications such as the analysis of big data, video rendering and artificial intelligence (for...

Read more »

Power-on-Package: Enabling Higher Performance in Artificial Intelligence Applications

August 22, 2017
By
Power-on-Package: Enabling Higher Performance in Artificial Intelligence Applications

Artificial intelligence, machine learning, big data mining and other demanding applications are driving CPU/GPU/ASIC (“XPU”) processor operating currents to hundreds of Amperes.

Read more »

Find out more about our Cool-Power Buck Regulators DCMs - A better Brick subscribe to vicor newsletter Contact Us

Get Connected