At GTC 2018, the Vicor team was on hand to watch the announcement of the NVIDIA DGX-2, presented as the most powerful AI system to date
At GTC 2018, the Vicor team was on hand to watch the announcement of the NVIDIA DGX-2, presented as the most powerful AI system to date
We recently announced our new Power on Package technology that enables manufacturers of CPUs, GPUs and ASICs (XPUs) to place power components either on the substrate of their device (on package) or extremely close to the XPU socket. Eliminating the “last inch” between the regulator and the XPU makes possible the level of higher performance required for today’s most demanding applications. The Need for Higher XPU Performance The demand for higher performance computing and communications systems is being driven by applications such as the analysis of big data, video rendering and artificial intelligence (for...
Artificial intelligence, machine learning, big data mining and other demanding applications are driving CPU/GPU/ASIC (“XPU”) processor operating currents to hundreds of Amperes.
