Posts Tagged ‘ EPDT ’

EPDT Explains how PFM in the VIA Package Helps Engineers Meet Key Design Metrics

July 6, 2015
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EPDT Explains how PFM in the VIA Package Helps Engineers Meet Key Design Metrics

EPDT recently published an article by Robert Russell, vice president of product marketing at Vicor, that explains how the PFM in VIA packaging technology allows engineers to use the Power Component Design Methodology

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