Posts Tagged ‘ ChiP ’

White Paper: Optimize Thermal Management of ChiP Products

March 4, 2014
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White Paper: Optimize Thermal Management of ChiP Products

The ChiP Platform provides a dramatic improvement in thermal management, allowing cooling through both the top and bottom sides of the package, as well as the leads. The thermal performance of this new packaging technology helps power system designers keep pace with the demands to increase power density at a greater rate than improvements in converter efficiency.

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Electronic Design Describes how Vicor Enables 400 V HVDC in the Data Center

February 24, 2014
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Electronic Design Describes how Vicor Enables 400 V HVDC in the Data Center

We’re really excited by the opportunities provided by HVDC power distribution. This Electronic Design article by Don Tuite looks at some of the history and drivers for the move to 400 VDC, going back to 2007 when this approach was initially proposed for power distribution. The article provides a fabulous case study of why some great ideas are hard to implement in the real world. Don reveals that 15 different nominal voltages have been proposed, and explains that 400 V was chosen because of its unique benefits; these include eliminating phase balancing, removing the need...

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Marco Panizza to Present Battery Charging Paper at DESIGN&ELEKTRONIK Forum

February 17, 2014
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Marco Panizza to Present Battery Charging Paper at DESIGN&ELEKTRONIK Forum

Marco Panizza, our European applications engineering manager, will present a paper at the DESIGN&ELEKTRONIK battery and chargers developer forum (ENTWICKLERFORUM: Batterien und Ladekonzepte 2014) on Wednesday, 19 February at 2:30pm. The paper will explain how the Sine Amplitude Converter (SAC) technology developed by Vicor can be used to create a bi-directional power system architecture for battery-powered applications. The SAC is a high-frequency resonant topology that is bi-directional by nature, allowing it to be used to act as the interface to a battery during charging, as well as when powering DC loads. Marco will describe...

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Learn More About the New 380 V BCM From Vicor

January 31, 2014
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Learn More About the New 380 V BCM From Vicor

The recently-released 380 VDC Bus Converter Module (BCM), the first product utilizing our new ChiP platform, has attracted a lot of attention. Efficiency of up to 98%, 1/8 step-down ratio and breakthrough power density (four times better than competing solutions) makes it an important device to enable HVDC power system architectures. In this video, Gary Gill, Director of Vicor’s VI Chip, explains the features of the ChiP BCM that allow engineers to develop power architectures that meet the efficiency, density and performance goals of the most demanding applications.     More information: 380 VDC...

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What’s in Store for Power Designers in 2014?

January 22, 2014
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What’s in Store for Power Designers in 2014?

Power Electronics has featured the views of Gary Gill, director of our VI Chip product line, in their Power Electronics 2014 Forecast. Gary considers the challenges of removing heat in power systems, highlighting the benefit of using multiple surfaces for cooling. Most systems take a simple approach to thermal design, cooling through the top surface. In 2014, and beyond, application requirements will demand higher power densities, so requiring thermal design approaches that are more sophisticated than simple topside cooling. Read Gary’s piece to see how new power packaging technologies and materials, such as those...

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Video Explains How New BCM Helps to Enable HVDC Architectures

January 15, 2014
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Video Explains How New BCM Helps to Enable HVDC Architectures

We have just announced the launch of our new Bus Converter Modules (BCM®) based on the new Converter Housed in Package (ChiP) platform. The new devices deliver 48 VDC from a nominal input of 380 VDC with 98% efficiency, making them ideal components for high voltage DC (HVDC) power distribution. In this video, Maurizio Salato, Director of Systems Engineering at Vicor, explains the functionality of the new devices, how the new BCM can be used to create very efficient HVDC power system architectures and the benefits of the approach for a range of different applications.  ...

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Vicor Launches First Product in Revolutionary ChiP Package

January 15, 2014
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Vicor Launches First Product in Revolutionary ChiP Package

Today Vicor announced the first product to use the revolutionary Converter housed in Package (ChiP) power component platform. The new ChiP bus converter modules (BCM®) deliver 48 Vdc with an output power of 1.2 kW, 98% peak efficiency and 1880 W/in3 (115 W/cm3) power density: a stunning four times the density of competing solutions. Gary Gill, Director, VI Chip product line at Vicor, was on-hand to answer our questions about the launch: This product uses new packaging: why is that important? This is the first product to be housed in the ChiP platform, which...

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