Posts Tagged ‘ ChiP ’

Analyze new DCMs’ Performance with PowerBench Whiteboard

June 30, 2014
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Analyze new DCMs’ Performance with PowerBench Whiteboard

We have added the new DC-DC Converter Modules (DCMs) to the portfolio of devices available on the Powerbench™ Whiteboard, allowing you to optimize and analyze power chains using these new components.

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The Latest Innovations in Power System Design

June 3, 2014
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The Latest Innovations in Power System Design

Power systems design is changing rapidly: in addition to innovations from power component suppliers such as Vicor, new standards mean that engineers must keep up to date with the latest ideas, approaches and best practices.

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New Power Systems Help Improve Performance of UAVs

May 28, 2014
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New Power Systems Help Improve Performance of UAVs

A recent article in ECN by Joshua Israelsohn, “Light UAVs serve both military and civilian missions”, describes how important it is to reduce weight to increase the performance on unmanned aerial vehicles (UAVs).

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New DCMs Bring High Power Density without Increasing Design Complexity

May 20, 2014
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New DCMs Bring High Power Density without Increasing Design Complexity

One of the most common challenges for electronics design engineers is the need for power density. Hybrid electric vehicles, for example, are one of the many applications that must deliver high levels of power, yet optimizing the use of space is one of the critical design goals.

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EDN Europe Explains Benefits of Bidirectional Conversion for Back-up Power Configurations

May 15, 2014
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EDN Europe Explains Benefits of Bidirectional Conversion for Back-up Power Configurations

The editor of EDN Europe, Graham Prophet, recently published an article that explains how Bidirectional DC/DC conversion enables efficient back-up power configurations.

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New BCM in ChiP Packaging Technology for HVDC: More Power, Higher Input Voltage

April 16, 2014
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New BCM in ChiP Packaging Technology for HVDC: More Power, Higher Input Voltage

We have just announced a new BCM designed for HVDC applications. The new device follows the announcement of the first BCM to use the ChiP platform a couple of months ago, and offers improved performance and increased functionality. The new device is optimized for up to 400 V DC nominal input voltage (260 to 410 V), supporting systems that use a 400 V HVDC bus, as well as those based on 380 V. It also offers significantly higher throughput, delivering 50V at 1.75 kW with 98% peak efficiency.

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Doug Ping Discusses the Importance of Packaging in Power Systems Design

March 13, 2014
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Doug Ping Discusses the Importance of Packaging in Power Systems Design

The March 2014 issue of Power Systems Design (PSD) North America features an article by Doug Ping that discusses the importance of packaging and thermo-mechanical design for power components.

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