Posts Tagged ‘ ChiP ’

The Most Popular Blog Posts in 2014

December 31, 2014
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At Vicor we are always working to generate content that engineers find useful, so we frequently check our website analytics to find out what is being read.

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High Voltage BCM in ChiP Package Named Power System Product of the Year

December 3, 2014
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High Voltage BCM in ChiP Package Named Power System Product of the Year

At Vicor we’re delighted that the High Voltage BCM in ChiP packaging technology was named Power System Product of the Year at the recent Elektra Awards ceremony in London, England.

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White Paper: A Novel Approach to Industrial Rectifier Systems

August 31, 2014
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White Paper: A Novel Approach to Industrial Rectifier Systems

AC-DC converters for industrial applications have been relying on double-stage architecture for quite a long time. A non-isolated, single- or three-phase, single- or multi-level stage typically feeds an isolated DC-DC stage, with capacitors between the two stages providing the necessary energy storage. The need for high efficiency and high density has determined the evolution of distributed power systems toward architectures that employ optimized power components. Among those power components, fixed-ratio bus converters have been developed to provide state-of-the-art performance, including components capable of 300-400V DC input that provide isolated, Safety-Extra-Low-Voltage (SELV) output. This paper,...

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The New MIL-COTS PRM® Regulator

August 28, 2014
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The New MIL-COTS PRM® Regulator

The new Vicor PRM regulator (MPRM48NF480M500A00) is based on our VI Chip® platform, and provides power density of 106W/cm3 and efficiency of 97.7%. The new regulator delivers 500W output power in the same package size as our earlier generation 120W MIL-COTS PRMs. For applications such as unmanned aerial vehicles (UAVs) this fourfold increase in power density can provide a game-changing advantage. Designers of military systems are acutely focused on achieving aggressive size, weight and power (SWAP) profiles that will give military vehicles greater agility to fulfill increasingly ambitious missions. Reducing the weight of UAVs...

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Packaging Innovations – Doubling the Surface Area for Cooling

July 29, 2014
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Packaging Innovations – Doubling the Surface Area for Cooling

This is the final blog post in a series of three written by Doug Ping, Principal Application Engineer at Vicor, which explain how packaging innovations play a critical role in the improvement of power system performance.

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Packaging Innovations: As Slick as a Brick

July 22, 2014
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Packaging Innovations: As Slick as a Brick

This is the second in a series of three blog posts written by Doug Ping, Principal Application Engineer at Vicor, which explain how packaging innovations play a critical role in the improvement of power system performance.

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Enabling Higher Performance Power Components with Packaging Innovations

July 15, 2014
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Enabling Higher Performance Power Components with Packaging Innovations

This is the first in a series of three blog posts written by Doug Ping, Principal Application Engineer at Vicor, which explain how packaging innovations play a critical role in the improvement of power system performance.

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