Posts Tagged ‘ award ’

China Information World Awards Vicor Green Data Center Solution 2015

May 7, 2015
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China Information World Awards Vicor Green Data Center Solution 2015

The Eighth China Data Center Conference, sponsored by China Information World, was recently held at Hotel Nikko New Century Beijing.

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Vicor HV BCM in ChiP Package Wins IDC Award in China

April 7, 2015
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We are delighted that our High Voltage Bus Converter Module (BCM) built on the Converter housed in Package (ChiP) platform has won a 2014-2015 China IDC Best Product & Solution Award.

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Advantest Award Recognizes Vicor’s Technology and Innovation

February 9, 2015
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It’s always good to win industry awards, but the ones that mean the most to us are from our customers. So we’re delighted that Advantest has presented us with a Technology and Innovation award

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High Voltage BCM in ChiP Package Named Power System Product of the Year

December 3, 2014
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High Voltage BCM in ChiP Package Named Power System Product of the Year

At Vicor we’re delighted that the High Voltage BCM in ChiP packaging technology was named Power System Product of the Year at the recent Elektra Awards ceremony in London, England.

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Vicor Encourages Engineers to Blog by Sponsoring Award

December 1, 2014
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Vicor Encourages Engineers to Blog by Sponsoring Award

Felice Caccavale, Vicor’s vice president sales & marketing – managing director EMEA, presented the Elektra Award for Electronics Technology Blog of the Year to the Raspberry Pi Blog

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Configurable VI Chip PRMs Named as One of the Ultimate Power Products of 2014

March 4, 2014
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Configurable VI Chip PRMs Named as One of the Ultimate Power Products of 2014

The configurable VI Chip PRMs have been shortlisted in the “Ultimate Products – Power” category of the 2014 ACE Awards.

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ChiP Platform Named in EDN Hot 100 for 2013

December 11, 2013
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ChiP Platform Named in EDN Hot 100 for 2013

EDN’s readers and journalists are excited about our new Converter housed in Package (ChiP) Platform, and have included the ChiP Platform in the components category of the prestigious EDN Hot 100 Awards 2013. Our CEO, Patrizio Vinciarelli, launched this new innovative packaging technology at APEC this year.  His presentation, which is available on our website, talked about the development of component power, and how ChiP technology will enable a dramatic improvement in performance for power components. Thermal design is one of the biggest challenges for power systems engineers, and the ChiP platform has been...

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