The Top 10 Challenges for Power Engineers

Vicor recently asked power engineers to tell us about their biggest challenges, and we received answers from around the global highlighting the difficulties of delivering power solutions for modern applications.

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Power-on-Package Enables High Efficiency in Gyoukou Supercomputer

Power-on-Package Enables High Efficiency in Gyoukou Supercomputer

At SC17 this week, ExaScaler and PEZY Computing unveiled their Gyoukou supercomputer, which uses our innovative Power-on-Package technology.

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Eliminating the Last Inch with Power on Package

Eliminating the Last Inch with Power on Package

We recently announced our new Power on Package technology that enables manufacturers of CPUs, GPUs and ASICs (XPUs) to place power components either on the substrate of their device (on package) or extremely close to the XPU socket. Eliminating the “last inch” between the regulator and the XPU makes possible the level of higher performance required for today’s most demanding applications. The Need for Higher XPU Performance The demand for higher performance computing and communications systems is being driven by applications such as the analysis of big data, video rendering and artificial intelligence (for...

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Join Vicor at the IEEE Power Electronics Symposium in New York and Learn More About Bidirectional Power Conversion

Join Vicor at the IEEE Power Electronics Symposium in New York and Learn More About Bidirectional Power Conversion

Join us on November 9 at the IEEE Power Electronics Symposium on Long Island, where our own David Bourner will present, “Bidirectional DC-DC Converter Systems

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DCM DC-DC Converters in ChiP Package Available with ±1% Regulation

DCM DC-DC Converters in ChiP Package Available with ±1% Regulation

Today we extended our family of isolated, regulated DC-DC converter modules (DCMs) in ChiP packages, with a range of components that offer ±1% voltage regulation.

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Using the Power Component Design Methodology to Adapt to Changing Specifications

Using the Power Component Design Methodology to Adapt to Changing Specifications

Late changes in requirements are not unusual: our recent research found it was the biggest challenge facing today’s power system designers.

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Compact Power for a Low-Profile Antenna Array

Compact Power for a Low-Profile Antenna Array

As the mobile phone market has matured and smartphones have become an indispensable part of daily life, people’s expectations for fast, reliable data access have escalated.

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