Vicor recently asked power engineers to tell us about their biggest challenges, and we received answers from around the global highlighting the difficulties of delivering power solutions for modern applications.
Vicor recently asked power engineers to tell us about their biggest challenges, and we received answers from around the global highlighting the difficulties of delivering power solutions for modern applications.
At SC17 this week, ExaScaler and PEZY Computing unveiled their Gyoukou supercomputer, which uses our innovative Power-on-Package technology.
We recently announced our new Power on Package technology that enables manufacturers of CPUs, GPUs and ASICs (XPUs) to place power components either on the substrate of their device (on package) or extremely close to the XPU socket. Eliminating the “last inch” between the regulator and the XPU makes possible the level of higher performance required for today’s most demanding applications. The Need for Higher XPU Performance The demand for higher performance computing and communications systems is being driven by applications such as the analysis of big data, video rendering and artificial intelligence (for...
Join us on November 9 at the IEEE Power Electronics Symposium on Long Island, where our own David Bourner will present, “Bidirectional DC-DC Converter Systems
Today we extended our family of isolated, regulated DC-DC converter modules (DCMs) in ChiP packages, with a range of components that offer ±1% voltage regulation.
Late changes in requirements are not unusual: our recent research found it was the biggest challenge facing today’s power system designers.
As the mobile phone market has matured and smartphones have become an indispensable part of daily life, people’s expectations for fast, reliable data access have escalated.
