Output Line Ripple on Power Factor Corrected AC-DC Power Supply Outputs (Part 5)

Output Line Ripple on Power Factor Corrected AC-DC Power Supply Outputs (Part 5)

This is the fifth in a series of blog posts by Harry Vig, Principal Applications Engineer at Vicor.

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What’s in Store for Power Designers in 2014?

What’s in Store for Power Designers in 2014?

Power Electronics has featured the views of Gary Gill, director of our VI Chip product line, in their Power Electronics 2014 Forecast. Gary considers the challenges of removing heat in power systems, highlighting the benefit of using multiple surfaces for cooling. Most systems take a simple approach to thermal design, cooling through the top surface. In 2014, and beyond, application requirements will demand higher power densities, so requiring thermal design approaches that are more sophisticated than simple topside cooling. Read Gary’s piece to see how new power packaging technologies and materials, such as those...

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‘Paultre on Power’ Features Gary Gill Explaining How To Increase Board-Level Power Density

‘Paultre on Power’ Features Gary Gill Explaining How To Increase Board-Level Power Density

Gary Gill, Director of Vicor’s VI Chip product line, was recently interviewed by Alix Paultre of Power Systems Design. In this podcast episode, Gary discussed the challenges of increasing power density at the board level, explaining how Vicor power components help engineers design products with higher system efficiency, improved thermal management and higher functionality in smaller form factors.

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My Journey: Rapid Prototyping of a Cell-Based, High Performance, High Power DC-DC Converter (part 2)

My Journey: Rapid Prototyping of a Cell-Based, High Performance, High Power DC-DC Converter (part 2)

In which I scavenge for parts and produce the demo on time. In the first part of this story I related how it seemed a good idea to create a power array demonstrator combining two “rafts” of different VI Chip parts together for a major project. One raft would be composed of PRM (pre-regulator modules), the other BCMs (Bus Converter Modules). Having settled on the design concept, I had to address connectivity of the PRM modules. The PR bus is a high-impedance line that delivers 10s of microamps to each slave PRM. I decided...

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Output Line Ripple on Power Factor Corrected AC-DC Power Supply Outputs (Part 4)

Output Line Ripple on Power Factor Corrected AC-DC Power Supply Outputs (Part 4)

This is the fourth in a series of blog posts by Harry Vig, Principal Applications Engineer at Vicor.

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Video Explains How New ChiP BCM Helps to Enable HVDC Architectures

We have just announced the launch of our new Bus Converter Modules (BCM®) based on the new Converter Housed in Package (ChiP) platform. The new devices deliver 48 VDC from a nominal input of 380 VDC with 98% efficiency, making them ideal components for high voltage DC (HVDC) power distribution. In this video, Maurizio Salato, Director of Systems Engineering at Vicor, explains the functionality of the new devices, how the new BCM can be used to create very efficient HVDC power system architectures and the benefits of the approach for a range of different applications.  ...

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Vicor Launches First Product in Revolutionary ChiP Package

Vicor Launches First Product in Revolutionary ChiP Package

Today Vicor announced the first product to use the revolutionary Converter housed in Package (ChiP) power component platform. The new ChiP bus converter modules (BCM®) deliver 48 Vdc with an output power of 1.2 kW, 98% peak efficiency and 1880 W/in3 (115 W/cm3) power density: a stunning four times the density of competing solutions. Gary Gill, Director, VI Chip product line at Vicor, was on-hand to answer our questions about the launch: This product uses new packaging: why is that important? This is the first product to be housed in the ChiP platform, which...

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