Earle Associates to Strengthen Southwestern U.S. Regional Sales Network

Earle Associates to Strengthen Southwestern U.S. Regional Sales Network

The Southwestern United States, spanning Arizona, Nevada, New Mexico and Texas will now be served by an enhanced sales and engineering force with our signing of Earle Associates. Earle’s expertise in semiconductor and electro-mechanical technology complements our full portfolio of high density, high efficiency power components. Customers specializing in computing, telecommunications, instrumentation and military electronics will be provided with comprehensive and experienced support to achieve their exacting power design goals from AC right through to the point of load. Operating out of local offices in Phoenix, El Paso, and Albuquerque, Earle Associates’ sales and...

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Arthur Russell to Present at IEEC 2013 Electronics Packaging Symposium

Arthur Russell to Present at IEEC 2013 Electronics Packaging Symposium

 Arthur Russell, VI Chip Factory Applications Engineer at Vicor, will present a paper at the upcoming 2013 Electronics Packaging Symposium, which will be held at Binghamton University in Binghamton, NY, USA. This event is organised by the Integrated Electronics Engineering Center (IEEC) at Binghampton University, which is part of The New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3iP). Arthur will present a paper entitled, 3-D ChiP Packaging & Cooling Enables Advances in High Power DC-DC Conversion on Tuesday 15th October at 2:30pm. Attendees will be able to learn...

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Rebroadcasts Now Available: Two-Part Webinar Series for Managing EMI in Modern Power Systems

Rebroadcasts Now Available: Two-Part Webinar Series for Managing EMI in Modern Power Systems

If you missed our popular live EMI two-part webinar series, you can catch up and watch the recorded versions now. Chris Swartz, Principal Application Engineer, provides a comprehensive understanding of the design challenges associated with managing EMI in modern power systems and solutions to overcome them. Part one focuses on the challenges of meeting EMI standards. Attenuating conducted EMI can be complex and difficult; Chris takes you through the causes of EMI, its impact and measurement and also explains the requirements of the various EMI standards. It will help engineers to understand much more...

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Technical Seminars in India: Solve Your EMI Problems

Later this month we will be holding half-day seminars in Bangalore and Hyderabad to help engineers solve their EMI problems. Attenuating conducted EMI can be complex and difficult, particularly if engineers do not fully understand the root cause or major factors that impact conducted EMI performance. These seminars will provide attendees with a comprehensive understanding of the causes, impact and measurement of EMI as well as offering advice, tips and techniques to reduce EMI. Engineers who attend the seminars will leave with the knowledge of how to design higher density, more efficient filtering systems. The...

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Maurizio Salato to present two technical papers at INTELEC 2013

Maurizio Salato to present two technical papers at INTELEC 2013

Vicor’s director of systems engineering, Maurizio Salato, will present technical papers discussing 380/400 VDC distribution for telecom and datacenter power applications during INTELEC® 2013. These presentations, which are part of the High Voltage DC technical program, were co-written with other leading power experts from across the industry. The first paper, “380 VDC Ecosystem Development: Present Status and Future Challenges” will be presented with representatives from HP, Universal Electric Corporation, Juniper Networks and Emerson Network Power. Attendees will hear an overview and progress update about the ecosystem development and future direction for 380 VDC distribution...

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Back to Basics: The Importance of Switching Frequency

Back to Basics: The Importance of Switching Frequency

The importance of switching frequency quickly becomes apparent to systems designers bringing regulated power to on-board semiconductor devices. With the continual demand for higher performance, CPUs, DSPs and other such devices grow more power-hungry. Accordingly, higher power density regulators with minimal PCB footprints have evolved; these use the latest in IC integration, MOSFETs and packaging. However, even these struggle keep pace with the continuing stream of newer, more powerful devices. With these pressures, it is tempting to increase regulator frequency, as this reduces the size and board footprint requirements of the associated passive devices...

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