Product Update

Vicor Launches First Product in Revolutionary ChiP Package

January 15, 2014
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Vicor Launches First Product in Revolutionary ChiP Package

Today Vicor announced the first product to use the revolutionary Converter housed in Package (ChiP) power component platform. The new ChiP bus converter modules (BCM®) deliver 48 Vdc with an output power of 1.2 kW, 98% peak efficiency and 1880 W/in3 (115 W/cm3) power density: a stunning four times the density of competing solutions. Gary Gill, Director, VI Chip product line at Vicor, was on-hand to answer our questions about the launch: This product uses new packaging: why is that important? This is the first product to be housed in the ChiP platform, which...

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ChiP Platform Named in EDN Hot 100 for 2013

December 11, 2013
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ChiP Platform Named in EDN Hot 100 for 2013

EDN’s readers and journalists are excited about our new Converter housed in Package (ChiP) Platform, and have included the ChiP Platform in the components category of the prestigious EDN Hot 100 Awards 2013. Our CEO, Patrizio Vinciarelli, launched this new innovative packaging technology at APEC this year.  His presentation, which is available on our website, talked about the development of component power, and how ChiP technology will enable a dramatic improvement in performance for power components. Thermal design is one of the biggest challenges for power systems engineers, and the ChiP platform has been...

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Power Electronics Europe Features the Thermal Performance of Vicor’s ChiP Technology

November 6, 2013
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Power Electronics Europe Features the Thermal Performance of Vicor’s ChiP Technology

No matter how efficiently your subsystem delivers energy, the residual dissipation and your ability to remove heat from the system limits power density. Waste energy, in the form of heat, is the enemy of power system designers. Although converter technology continues to increase efficiency, particularly components based upon Vicor’s Sine Amplitude Converter (SAC), there will always be some waste heat that needs to be removed. Power Electronics Europe features an article by Gary Gill, Vicor’s Director V.I Chip Product Line, which defines the problem, explaining that heat is typically the factor that limits power...

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Optimizing for Datacenter Power System Efficiency and Reduced Energy Costs

September 10, 2013
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Optimizing for Datacenter Power System Efficiency and Reduced Energy Costs

There are no sloppy designs in datacenters. To the consumer a datacenter is just another pipe in the cloud, a conduit for their data and experiences.  However, to the industry giants wringing real dollars (in the form of demographic studies, transactional charges, and raw click-based advertising) a datacenter is the backbone of their business operations. Just like the assembly lines of Ford and the coke furnaces of Carnegie, the most efficient (least cost to operate) datacenter provides the greatest set of financial and operational benefits to their owners.

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Rugged MIL-COTS PFC Front End Meets Stringent Demands In Aerospace & Defense

July 15, 2013
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Rugged MIL-COTS PFC Front End Meets Stringent Demands In Aerospace & Defense

Boasting a wide input range of 102 – 264 Vac (input operation down to 85 VAC, subject to additional derating) and a rugged construction,  Vicor’s MIL-COTS PFC Front End (GP-MPFC1H21) is capable of meeting most demanding defense and aerospace applications.

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Video on engineeringtv.com: the technology behind the Cool-Power ZVS DC-DC Converters

July 8, 2013
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Claudio Tuozzolo talks to ‘Electronic Design Europe’ editor, Sally Ward-Foxton, at PCIM 2013 about  the technology behind the Picor Cool-Power® PI31xx series of isolated, ZVS-based DC-DC converters.

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Video interview presenting ChiP packaging technology

July 1, 2013
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Claudio Tuozzolo introduces Vicor’s ChiP (Converter Housed in Package) packaging technology to ‘Electronic Design Europe’ editor, Paul Whytock, at the PCIM show in Nuremberg, Germany. 

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