Product Update

New Solution Helps Designers Create VR12.5 Server Power Solutions

April 29, 2014
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New Solution Helps Designers Create VR12.5 Server Power Solutions

Today we announced a solution for the Intel processor power standard VR12.5, which enables peak efficiency of 94% for Haswell-based x86 systems, even at low load, without the need for complex power management schemes

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New BCM in ChiP Packaging Technology for HVDC: More Power, Higher Input Voltage

April 16, 2014
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New BCM in ChiP Packaging Technology for HVDC: More Power, Higher Input Voltage

We have just announced a new BCM designed for HVDC applications. The new device follows the announcement of the first BCM to use the ChiP platform a couple of months ago, and offers improved performance and increased functionality. The new device is optimized for up to 400 V DC nominal input voltage (260 to 410 V), supporting systems that use a 400 V HVDC bus, as well as those based on 380 V. It also offers significantly higher throughput, delivering 50V at 1.75 kW with 98% peak efficiency.

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Electronic Design Describes how Vicor Enables 400 V HVDC in the Data Center

February 24, 2014
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Electronic Design Describes how Vicor Enables 400 V HVDC in the Data Center

We’re really excited by the opportunities provided by HVDC power distribution. This Electronic Design article by Don Tuite looks at some of the history and drivers for the move to 400 VDC, going back to 2007 when this approach was initially proposed for power distribution. The article provides a fabulous case study of why some great ideas are hard to implement in the real world. Don reveals that 15 different nominal voltages have been proposed, and explains that 400 V was chosen because of its unique benefits; these include eliminating phase balancing, removing the need...

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Learn More About the New 380 V BCM From Vicor

January 31, 2014
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The recently-released 380 VDC Bus Converter Module (BCM), the first product utilizing our new ChiP platform, has attracted a lot of attention. Efficiency of up to 98%, 1/8 step-down ratio and breakthrough power density (four times better than competing solutions) makes it an important device to enable HVDC power system architectures. In this video, Gary Gill, Director of Vicor’s VI Chip, explains the features of the ChiP BCM that allow engineers to develop power architectures that meet the efficiency, density and performance goals of the most demanding applications.       More information: 380...

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Video Explains How New BCM Helps to Enable HVDC Architectures

January 15, 2014
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We have just announced the launch of our new Bus Converter Modules (BCM®) based on the new Converter Housed in Package (ChiP) platform. The new devices deliver 48 VDC from a nominal input of 380 VDC with 98% efficiency, making them ideal components for high voltage DC (HVDC) power distribution. In this video, Maurizio Salato, Director of Systems Engineering at Vicor, explains the functionality of the new devices, how the new BCM can be used to create very efficient HVDC power system architectures and the benefits of the approach for a range of different applications.  ...

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Vicor Launches First Product in Revolutionary ChiP Package

January 15, 2014
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Vicor Launches First Product in Revolutionary ChiP Package

Today Vicor announced the first product to use the revolutionary Converter housed in Package (ChiP) power component platform. The new ChiP bus converter modules (BCM®) deliver 48 Vdc with an output power of 1.2 kW, 98% peak efficiency and 1880 W/in3 (115 W/cm3) power density: a stunning four times the density of competing solutions. Gary Gill, Director, VI Chip product line at Vicor, was on-hand to answer our questions about the launch: This product uses new packaging: why is that important? This is the first product to be housed in the ChiP platform, which...

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ChiP Platform Named in EDN Hot 100 for 2013

December 11, 2013
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ChiP Platform Named in EDN Hot 100 for 2013

EDN’s readers and journalists are excited about our new Converter housed in Package (ChiP) Platform, and have included the ChiP Platform in the components category of the prestigious EDN Hot 100 Awards 2013. Our CEO, Patrizio Vinciarelli, launched this new innovative packaging technology at APEC this year.  His presentation, which is available on our website, talked about the development of component power, and how ChiP technology will enable a dramatic improvement in performance for power components. Thermal design is one of the biggest challenges for power systems engineers, and the ChiP platform has been...

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