Product Update

Video on engineeringtv.com: the technology behind the Cool-Power ZVS DC-DC Converters

July 8, 2013
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Claudio Tuozzolo talks to ‘Electronic Design Europe’ editor, Sally Ward-Foxton, at PCIM 2013 about  the technology behind the Picor Cool-Power® PI31xx series of isolated, ZVS-based DC-DC converters.

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Video interview presenting ChiP packaging technology

July 1, 2013
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Claudio Tuozzolo introduces Vicor’s ChiP (Converter Housed in Package) packaging technology to ‘Electronic Design Europe’ editor, Paul Whytock, at the PCIM show in Nuremberg, Germany. 

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Video: Cool-Power ZVS DC-DC High Density Converter Modules

June 17, 2013
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Vicor’s new Cool-Power DC-DC converters utilize an advanced Zero-Voltage Switching (ZVS) architecture and high-performance planar magnetics to enable IC-like density and greater PCB layout flexibility in space-constrained environments. The high-switching frequency (900 kHz) of series converters reduces input filter and output capacitance requirements, drastically reducing space requirements.

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How Adaptive Cell Topology Benefits AC Applications

June 11, 2013
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With the wide variation in AC line voltages around the world, universal power supplies are typically designed to accept 85VRMS to 264VRMS inputs. This range has imposed significant design trade-offs on the power factor corrected AC rectification typically used in front end converters. The Vicor PFM isolated AC-DC converter with PFC, and the AC Front End Module both have Adaptive Cell™ topology at their heart, providing a breakthrough in AC front end power factor correction that addresses these trade-offs to provide a consistently efficient solution. It does so by introducing innovation at three different...

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Vicor’s Converter housed in Package (ChiP) Technology

Vicor has pioneered a breakthrough power component packaging platform – “Converter housed in Package” – or “ChiP” for short. Vicor‘s ChiP technology enables much smaller and more flexible component form factors, advancing power component design methodologies by simplifying design processes, and delivering power systems in a small form factor.

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An Introduction to ChiP Technology

May 13, 2013
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An Introduction to ChiP Technology

In this latest video Steve Oliver, VP VI Chip Division, presents an introduction to Vicor’s new ChiP technology (“Converter Housed in Package”).  This exciting new technology has been developed to enable the next generation of power components The demand is for ever smaller power components able to handle more power and greater loads.  Yet the development of these products is being hampered by resulting heat dissipation issues.  Our ChiP packaging technology provides the breakthrough necessary to achieve size and performance levels previously thought to be impossible. And the flexibility of the technology will enable...

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