Technical Articles

Thermal Management for Picor Cool-Power Isolated DC-DC Converters

May 4, 2012
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Thermal Management for Picor Cool-Power Isolated DC-DC Converters

This is the second in a three-part series that discusses thermal management issues, and how to address them for different product types.

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Is IBA the Right Architecture
for your Application? (Part 2)

April 26, 2012
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Is IBA the Right Architecture for your Application? (Part 2)

In part one we talked about the advantages of the IBA, and some of the considerations that need to be borne in mind when considering implementing this approach to power. In part 2 we continue to look at the limitations and issues with this approach.

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Is IBA the Right Architecture for your Application?
(Part 1)

April 2, 2012
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Is IBA the Right Architecture for your Application? (Part 1)

For a majority of applications implemented today, the Intermediate Bus Architecture has been the preferred power architecture.

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Thermal Considerations for High Power Density DC-DC Bricks

March 30, 2012
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Thermal Considerations for High Power Density DC-DC Bricks

As DC-DC converters continually increase in power density, careful thermal management is essential to maximise their usable power. Efficiency, although important, is not the only factor. Removal of dissipated heat is also essential, because product reliability and operational life relate inversely to operating temperature. Therefore, robust power system design calls for thermal management that effectively handles load and environmental demands in practice as well as in theory. A converter’s conversion efficiency is the ratio between output and input power. This efficiency depends on its operating parameters, particularly input voltage and output current as well...

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Meeting Conducted Noise Standards

March 30, 2012
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Meeting Conducted Noise Standards

Finding an efficient, compact solution to meeting EMI requirements is a greater challenge than ever.

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Power Distribution Solutions for Densely-Populated PCBs

March 5, 2012
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Power Distribution Solutions for Densely-Populated PCBs

As electronic PCBs become more densely packed and supply rail voltages proliferate, delivering the right power to all on-board devices with optimal space and power efficiency becomes essential. This article looks at developments in power distribution architecture and device technology that allows designers to achieve this optimization. As the electronics industry has developed, some inexorable trends have become apparent. Boards decrease in size and become more densely populated. Supply voltages demanded by on-board IC devices such as CPUs, DSPs, FPGAs, logic and memory have proliferated and there is a tendency towards lower levels such...

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Distributed Power Architecture: What’s the Problem?

March 1, 2012
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Distributed Power Architecture: What’s the Problem?

Since the 1980s the bricks of distributed power architecture (DPA) have delivered the classic functions of DC-DC converters (isolation, voltage transformation and regulation) to the point of load. But …at a price in terms of premium space and cost.

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