Company News

New DCMs Bring High Power Density without Increasing Design Complexity

May 20, 2014
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New DCMs Bring High Power Density without Increasing Design Complexity

One of the most common challenges for electronics design engineers is the need for power density. Hybrid electric vehicles, for example, are one of the many applications that must deliver high levels of power, yet optimizing the use of space is one of the critical design goals.

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Vicor Strengthens European Partnership with Powerbox-Craftec

April 28, 2014
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Vicor Strengthens European Partnership with Powerbox-Craftec

Vicor and Powerbox-Craftec, one of Europe´s leading power distributors have signed a long-term partnership agreement. Powerbox-Craftec will focus its expert power systems sales and application engineers on demand-creation for Vicor’s new ChiP and SiP-based power components. The pan-European agreement extends Powerbox-Craftec’s markets to also include Germany, Belgium, Luxemburg and The Netherlands.

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New ChiP BCM for HVDC: More Power, Higher Input Voltage

April 16, 2014
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New ChiP BCM for HVDC: More Power, Higher Input Voltage

We have just announced a new BCM designed for HVDC applications. The new device follows the announcement of the first BCM to use the ChiP platform a couple of months ago, and offers improved performance and increased functionality. The new device is optimized for up to 400 V DC nominal input voltage (260 to 410 V), supporting systems that use a 400 V HVDC bus, as well as those based on 380 V. It also offers significantly higher throughput, delivering 50V at 1.75 kW with 98% peak efficiency.

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Configurable VI Chip PRMs Named as One of the Ultimate Power Products of 2014

March 4, 2014
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Configurable VI Chip PRMs Named as One of the Ultimate Power Products of 2014

The configurable VI Chip PRMs have been shortlisted in the “Ultimate Products – Power” category of the 2014 ACE Awards.

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Meet Vicor at electronica China 2014

March 3, 2014
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Meet Vicor at electronica China 2014

Vicor will be exhibiting at electronica China 2014, the largest electronic components and systems show in China and the Asian-Pacific region. Visit us in Hall W1, on booth 1402, to learn more about the latest power products and technology. At the event, we will showcase our latest products, including the new 380 VDC Bus Converter Module that is enabling the deployment of HVDC power distribution in data centers, commercial buildings and offices. You’ll also have the opportunity to learn more about our Converter housed in Package (ChiP) technology that provides the platform for the...

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Video Explains How New ChiP BCM Helps to Enable HVDC Architectures

January 15, 2014
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We have just announced the launch of our new Bus Converter Modules (BCM®) based on the new Converter Housed in Package (ChiP) platform. The new devices deliver 48 VDC from a nominal input of 380 VDC with 98% efficiency, making them ideal components for high voltage DC (HVDC) power distribution. In this video, Maurizio Salato, Director of Systems Engineering at Vicor, explains the functionality of the new devices, how the new BCM can be used to create very efficient HVDC power system architectures and the benefits of the approach for a range of different applications.  ...

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