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New ChiP BCM for HVDC: More Power, Higher Input Voltage

April 16, 2014
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New ChiP BCM for HVDC: More Power, Higher Input Voltage

We have just announced a new BCM designed for HVDC applications. The new device follows the announcement of the first BCM to use the ChiP platform a couple of months ago, and offers improved performance and increased functionality. The new device is optimized for up to 400 V DC nominal input voltage (260 to 410 V), supporting systems that use a 400 V HVDC bus, as well as those based on 380 V. It also offers significantly higher throughput, delivering 50V at 1.75 kW with 98% peak efficiency. This means a power density of...

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Configurable VI Chip PRMs Named as One of the Ultimate Power Products of 2014

March 4, 2014
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Configurable VI Chip PRMs Named as One of the Ultimate Power Products of 2014

The configurable VI Chip PRMs have been shortlisted in the “Ultimate Products – Power” category of the 2014 ACE Awards.

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Meet Vicor at electronica China 2014

March 3, 2014
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Meet Vicor at electronica China 2014

Vicor will be exhibiting at electronica China 2014, the largest electronic components and systems show in China and the Asian-Pacific region. Visit us in Hall W1, on booth 1402, to learn more about the latest power products and technology. At the event, we will showcase our latest products, including the new 380 VDC Bus Converter Module that is enabling the deployment of HVDC power distribution in data centers, commercial buildings and offices. You’ll also have the opportunity to learn more about our Converter housed in Package (ChiP) technology that provides the platform for the...

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Video Explains How New ChiP BCM Helps to Enable HVDC Architectures

January 15, 2014
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We have just announced the launch of our new Bus Converter Modules (BCM®) based on the new Converter Housed in Package (ChiP) platform. The new devices deliver 48 VDC from a nominal input of 380 VDC with 98% efficiency, making them ideal components for high voltage DC (HVDC) power distribution. In this video, Maurizio Salato, Director of Systems Engineering at Vicor, explains the functionality of the new devices, how the new BCM can be used to create very efficient HVDC power system architectures and the benefits of the approach for a range of different applications.  ...

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Vicor Launches First Product in Revolutionary ChiP Package

January 15, 2014
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Vicor Launches First Product in Revolutionary ChiP Package

Today Vicor announced the first product to use the revolutionary Converter housed in Package (ChiP) power component platform. The new ChiP bus converter modules (BCM®) deliver 48 Vdc with an output power of 1.2 kW, 98% peak efficiency and 1880 W/in3 (115 W/cm3) power density: a stunning four times the density of competing solutions. Gary Gill, Director, VI Chip product line at Vicor, was on-hand to answer our questions about the launch: This product uses new packaging: why is that important? This is the first product to be housed in the ChiP platform, which...

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Live Webinar in Russian Explains How to Reduce EMI and Minimize Filter Size

January 10, 2014
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Live Webinar in Russian Explains How to Reduce EMI and Minimize Filter Size

Reducing EMI is a key task for power system designers. With the pressure to increase density of modern electronic systems, engineers have limited PCB real estate for power supplies and EMI filters, putting pressure on engineers to achieve maximum filtering efficiency in minimal space. Lev Slutskiy, Technical Sales Engineer at Vicor, will present the second in a series of Russian-language webinars explaining how to meet the challenge of EMI on Wednesday, January 29, 2014 at 12:00 (Moscow). There is no charge to attend the webinar, but participants must register in advance. The webinar covers...

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ChiP Platform Named in EDN Hot 100 for 2013

December 11, 2013
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ChiP Platform Named in EDN Hot 100 for 2013

EDN’s readers and journalists are excited about our new Converter housed in Package (ChiP) Platform, and have included the ChiP Platform in the components category of the prestigious EDN Hot 100 Awards 2013. Our CEO, Patrizio Vinciarelli, launched this new innovative packaging technology at APEC this year.  His presentation, which is available on our website, talked about the development of component power, and how ChiP technology will enable a dramatic improvement in performance for power components. Thermal design is one of the biggest challenges for power systems engineers, and the ChiP platform has been...

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Popular EMI Webinar Series to be Presented in Russian

November 25, 2013
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Popular EMI Webinar Series to be Presented in Russian

ElectroMagnetic Compatibility & Interference is one of the most important topics for any power system engineer. Vicor is presenting its two-part EMI webinar in Russian, allowing Russian-speaking engineers to learn in their own language how to overcome this crucial challenge.

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KMA Sales to Enhance Support for Vicor in Northern Illinois

November 25, 2013
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KMA Sales to Enhance Support for Vicor in Northern Illinois

Vicor has partnered with KMA Sales to strengthen our sales and distribution network in northern Illinois. This important region is home to many OEMs, design consultants, and contract manufacturers, all of which will benefit from the addition of KMA Sales.

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The New Vicorpower.com website. Making it easier to design your power system

November 14, 2013
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The New Vicorpower.com website.  Making it easier to design your power system

In conversations with power design engineers over the last year, we identified several areas where we could improve our website to make the design challenge easy. As part of research we undertook engineers took us through their design process and how they needed a website to support that process. It was that information we used as the basis for the redesign and enhancement of vicorpower.com. The areas where we focused our improvement efforts include making it easy to navigate, select, configure, architect and design advanced power systems. In the area of navigation, we simplified...

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