This post looks at the three reasons and three distinct advantages that power components offer in your power system design.
This post looks at the three reasons and three distinct advantages that power components offer in your power system design.
It was very busy at APEC 2013 last month. The conference packed with excellent technical papers, was attended by 4,000 people (a record for this conference). Vicor was proud to participate in this conference and to be part of the exposition. Dr. Patrizio Vinciarelli, Vicor’s CEO, presented a new innovation – a packaging technology we are calling ChiP (Converter housed in Package). You can learn more about ChiP technology by following this link or watching the video below.
On Monday, March 18, 2013, Vicor announced new breakthrough technology enabling the next generation of highly efficient, high density power systems designed based on a power component methodology. Follow this link to learn more and sign up for more information about this power innovation.
Designers can now configure and customize Vicor’s VI Chip PRM modules quickly and efficiently using the new PowerBench tool. This is the first time that we’ve broadened our customization to VI Chip products, allowing designers to exploit the high-frequency, ZVS buck-boost technology in a configuration to meet the exact needs of the their application, without incurring NRE costs.
With telecom and datacenters becoming ever more important to our work and leisure activities, the demand placed upon these applications is increasing dramatically. Every percentage-point increase in efficiency results in significant cash saving for the operator – and hopefully, the customer – in the cost of wasted power.
