Vicor has expanded its ultra high density Picor Cool-Power® PI31xx series of isolated, ZVS-based DC-DC converters optimized for 24V industrial, 28V aerospace/defense and/or demanding wide temperature applications.
In this latest video Steve Oliver, VP VI Chip Division, presents an introduction to Vicor’s new ChiP technology (“Converter Housed in Package”). This exciting new technology has been developed to enable the next generation of power components The demand is for ever smaller power components able to handle more power and greater loads. Yet the development of these products is being hampered by resulting heat dissipation issues. Our ChiP packaging technology provides the breakthrough necessary to achieve size and performance levels previously thought to be impossible. And the flexibility of the technology will enable...
Among the many challenges of AC-DC converters and Power Factor Corrected (PFC) AC rectification is maintaining the desired performance across the worldwide mains, from low through high line, 85VRMS to 264VRMS. Maintaining high efficiency and power-factor usually forces design tradeoffs and operating compromises. The thermal system, as well as active and magnetic power components, has to be specified for worst-case scenarios. An alternative approach for the OEM is to “regionalize” the supply, but this also results in other design and supply chain drawbacks.
In light of the horrific bombings at the Boston Marathon, Vicor offers our thoughts to the victims and their families. We also thank the first responders for their bravery in helping the victims and protecting others from additional attacks.
It was very busy at APEC 2013 last month. The conference packed with excellent technical papers, was attended by 4,000 people (a record for this conference). Vicor was proud to participate in this conference and to be part of the exposition. Dr. Patrizio Vinciarelli, Vicor’s CEO, presented a new innovation – a packaging technology we are calling ChiP (Converter housed in Package). You can learn more about ChiP technology by following this link or watching the video below.
On Monday, March 18, 2013, Vicor announced new breakthrough technology enabling the next generation of highly efficient, high density power systems designed based on a power component methodology. Follow this link to learn more and sign up for more information about this power innovation.
Designers can now configure and customize Vicor’s VI Chip PRM modules quickly and efficiently using the new PowerBench tool. This is the first time that we’ve broadened our customization to VI Chip products, allowing designers to exploit the high-frequency, ZVS buck-boost technology in a configuration to meet the exact needs of the their application, without incurring NRE costs.
Fan and force-air cooling in power systems is noisy, and fans introduce potential reliability problems. To address the requirement for noiseless, high-reliability AC-DC converters that we see from our customers who are designing for demanding applications such as military, industrial and telecommunications, Vicor has introduced the high-efficiency Westcor™ MicroPAC™ power factor corrected AC-DC power system.