In this latest video Steve Oliver, VP VI Chip Division, presents an introduction to Vicor’s new ChiP technology (“Converter Housed in Package”). This exciting new technology has been developed to enable the next generation of power components The demand is for ever smaller power components able to handle more power and greater loads. Yet the development of these products is being hampered by resulting heat dissipation issues. Our ChiP packaging technology provides the breakthrough necessary to achieve size and performance levels previously thought to be impossible. And the flexibility of the technology will enable...
