It’s not uncommon for power design projects to encounter cost and time overruns during the development phase.
It’s not uncommon for power design projects to encounter cost and time overruns during the development phase.
Power density is a key metric for power system designers. Although it’s obvious that wasting space makes little sense, increasing the power density (and therefore decreasing power system size) is a valuable activity
The huge gains in processing performance achieved in recent years have begun to unlock the vast potential of artificial intelligence (AI), propelling it from nascent technology enabling image and speech recognition applications
Most modern electronic systems are powered by DC voltages. DC supplies are so common it’s easy to ignore the basics.
Power-on-Package (PoP) is a new approach that overcomes the obstacles associated with delivering high currents to CPUs or GPUs (or simply XPUs) through the “last inch”.
The increasing power requirements of modern systems, the demand for higher efficiencies and the need to achieve this with limited space means power developers are reconsidering the way they design systems.
Today we announced a family of next generation of DC-DC Converter Modules (DCMs) in ChiP packaging technology. With a very wide input range (43 – 154V)
