
Electronic Specifier has recently published a couple of articles about the importance of packaging in power system design, focusing on the Vicor Power-on-Package technology.
At PCIM Europe 2018 (5-7 June in Nuremberg) Vicor will be highlighting various high performance power solutions for LED Lighting, Telecom, Datacenter, Industrial, and Electric Vehicle applications. The Vicor Power-on-Package solution with 3M immersion cooling will be demonstrated, establishing a new benchmark in power density for 48V direct to CPU/GPU power rails. Also in the booth will be our NBM and ZVS regulator devices, providing 48V buck, buck-boost, and boost solutions at unprecedented power efficiency and density levels. Visit the Vicor booth (Hall 9, Stand 443) to see the latest in DC-DC power conversion...