Blog Archives

400V – 700V is no Longer a Power Component “Wasteland”

December 5, 2017
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400V – 700V is no Longer a Power Component “Wasteland”

A number of different power systems, including 3-phase power supplies and tethered unmanned autonomous vehicles (UAVs) operate with bus voltages in the hundreds of volts

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From the users – 5 Reasons to Use the Power System Designer

December 5, 2017
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From the users – 5 Reasons to Use the Power System Designer

Like any company, we’re very enthusiastic about our products and the tools we develop to support them. We’re particularly excited about the Power System Designer online design tool

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The Most Popular Blog Posts from 2017

December 1, 2017
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It’s always interesting to see what topics are important to power engineers, and the traffic to our blog is a great indication of what matters to you.

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Mission-Critical Power Start-up Challenges Addressed in Military Embedded Systems Article

November 28, 2017
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Mission-Critical Power Start-up Challenges Addressed in Military Embedded Systems Article

Military Embedded Systems recently published an article explaining how to ensure flawless operation of rapid-start isolated power systems for mission-critical applications.

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The Top 10 Challenges for Power Engineers

November 25, 2017
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Vicor recently asked power engineers to tell us about their biggest challenges, and we received answers from around the global highlighting the difficulties of delivering power solutions for modern applications.

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Power-on-Package Enables High Efficiency in Gyoukou Supercomputer

November 17, 2017
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Power-on-Package Enables High Efficiency in Gyoukou Supercomputer

At SC17 this week, ExaScaler and PEZY Computing unveiled their Gyoukou supercomputer, which uses our innovative Power-on-Package technology.

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Eliminating the Last Inch with Power on Package

November 7, 2017
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Eliminating the Last Inch with Power on Package

We recently announced our new Power on Package technology that enables manufacturers of CPUs, GPUs and ASICs (XPUs) to place power components either on the substrate of their device (on package) or extremely close to the XPU socket. Eliminating the “last inch” between the regulator and the XPU makes possible the level of higher performance required for today’s most demanding applications. The Need for Higher XPU Performance The demand for higher performance computing and communications systems is being driven by applications such as the analysis of big data, video rendering and artificial intelligence (for...

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