New Power-on-Package MCM Can Deliver Peak Currents of up to 1000A

March 6, 2018

Power-on-Package (PoP) is a new approach that overcomes the obstacles associated with delivering high currents to CPUs or GPUs (or simply XPUs) through the “last inch”. Today we announced new PoP components that can provide 600A continuously and up to 1,000A peak at up to 1V. The new PoP power components, the MCM4608S59Z01B5T00 Modular Current Multiplier (MCM) and a MCD4609S60E59H0T00 Modular Current Multiplier Driver (MCD) offer dramatic performance improvements over conventional power solutions for XPUs.

Power-on-Package MCM MCDOwing to their high density, low profile package (46 x 8 x 2.7mm) and low noise attributes, MCMs are suitable for co-packaging within the XPU substrate or adjacent to it. PoP MCDs supply power at 48V to the MCMs, which multiply current and divide voltage. The close proximity of the MCM to the XPU eliminates substantial power loss and bandwidth limitations incurred in the “last inch” of the current delivery path from the boundaries of 12V multi-phase regulators.

Power-on-Package modules build upon the Factorized Power Architecture (FPA) that supports efficient power distribution and direct conversion from 48V to sub-1V XPUs. With current multiplication deployed in close proximity to high current processors, PoP MCMs overcome previous barriers to improved performance.

Power-on-Package is an enabling technology for a range of high-performance applications, including Artificial Intelligence (“AI”) and autonomous driving systems.


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