Electronic Products Award for our Power-on-Package Solution

January 10, 2018
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electronic products award 2017We are honored to have received an Electronic Products’ Product of the Year award for our Power-on-Package modular current multipliers (MCM), which represents yet more recognition for this revolutionary technology. Power-on-Package eliminates the challenges of the “last inch” in power systems for high performance, high current, CPU/GPU/ASIC (“XPU”) processors.

The winning products in each of the award’s 12 categories were selected based on innovative design, significant advancement in technology or application, and substantial achievement in price and performance. Power-on-Package technology delivers breakthrough performance among power products by freeing up XPU socket pins and eliminating interconnect losses from the motherboard to the XPU, enabling higher current delivery for maximum XPU performance.

The Electronic Products award isn’t the first award we won for 2017, as EDN named the PI3526-00-LGIZ ZVS buck Regulator one of their Hot 100 Products of the Year, reflecting the way our products help engineers overcome a wide variety of power design challenges.

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