Thermal Management of VIA and ChiP Products

April 4, 2017

Thermal management of VIA and ChiP Products - White PaperHigh performance power components require packaging technology that is thermally adept to allow for heat to be removed easily. Our VIA and ChiP products both offer outstanding thermal performance: heat can be removed from the top surface, the bottom surface, or both surfaces on a VIA module and from the top surface, the bottom surface, and the leads of a ChiP package.

Our new application note, “Thermal Management for VIA and ChiP Modules” helps simplify the design of cooling systems for these packages, covering:

  • Efficiency and Dissipated Power
  • Removing Heat from the Module
  • VIA and ChiP Thermal Models
  • Conduction cooling
  • Convection cooling
  • Vicor Online Tools
  • Thermal Equations

To download the applications note, and ensure that your next design optimizes the thermal performance of power components in ChiP or VIA packaging technology, simply complete the form below:


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