Vicor HV BCM in ChiP Package Wins IDC Award in China

April 7, 2015

We are delighted that our High Voltage Bus Converter Module (BCM) built on the Converter housed in Package (ChiP) platform has won a 2014-2015 China IDC Best Product & Solution Award. These prestigious awards recognize technology innovations that are important to the Chinese market, and it’s great that IDC has recognized the importance of both the ChiP platform and the HV BCM to the Chinese datacenter industry.

The award was presented at the IDC conference in Beijing, which was attended by more than 800 people from the Chinese IT industry.

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