heatsink and fan for ChiP package

July 3, 2014
By

Figure 5: Power management devices taking advantage of advanced packaging can deliver as much as 1.5 kW from cells measuring less than 10 in3 including heatsinks and fan

Leave a Comment

Your email address will not be published. Required fields are marked *

Find out more about our Cool-Power Buck Regulators subscribe to vicor newsletter Contact Us

Get Connected