White Paper: Optimize Thermal Management of ChiP Products

March 4, 2014
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chip thermal white paperThe ChiP Platform provides a dramatic improvement in thermal management, allowing cooling through both the top and bottom sides of the package, as well as the leads. The thermal performance of this new packaging technology helps power system designers keep pace with the demands to increase power density at a greater rate than improvements in converter efficiency.

This white paper describes a model of the thermal performance of the ChiP plaform and describes the range of online design tools available from Vicor to help designers optimize the thermal performance of their systems.

To receive a copy of this paper, please fill in your details in the registration form below:

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