Vicor Launches First Product in Revolutionary ChiP Package

January 15, 2014

ChiP-BCM-photo-with-text-smallToday Vicor announced the first product to use the revolutionary Converter housed in Package (ChiP) power component platform. The new ChiP bus converter modules (BCM®) deliver 48 Vdc with an output power of 1.2 kW, 98% peak efficiency and 1880 W/in3 (115 W/cm3) power density: a stunning four times the density of competing solutions.

Gary Gill, Director, VI Chip product line at Vicor, was on-hand to answer our questions about the launch:

This product uses new packaging: why is that important?

This is the first product to be housed in the ChiP platform, which enables the highest power density through its superior thermal performance. It enables a step-change in power density available to engineers, offering four times the power density of competing solutions. Engineers can use this technology to dramatically reduce the size and weight of their systems.

How does the ChiP platform achieve the performance?

ChiP platform products use advanced magnetic structures that are integrated within high density interconnect (HDI) substrates, together with power semiconductors and control ASICs. This enables unprecedented thermal performance, efficiency and power density. There’s more information about the technology in our ChiP platform white paper.

What are the main applications for the first product, the BCM?

The new BCM in the ChiP packaging technology has a nominal input voltage of 380V, and delivers 48 Vdc. This is ideal to support the roll-out of higher voltage DC distribution in datacenter, datacom, telecom and industrial facilities that reduces power consumption and operational costs.

The ChiP BCMs are also capable of bi-directional operation to support battery backup and renewable energy applications.

Can you tell us more about the specifications of the device?

The BCM has a K-factor of 1/8, and operates from an input voltage range of 260 to 410 Vdc. This means that it will support outputs from 32.5 to 51.25 Vdc. It’s based upon our ZCS/ZVS Sine Amplitude Converter™ topology, switching at 1.25 MHz, which ensures a fast response to transients and low noise.

What if an application needs more than 1.2 kW?

It’s easy to parallel the devices, so you can develop systems that deliver more than 1.2 kW.

How big is the package?

The new BCM is supplied in the 6123 ChiP package, measuring 63mm by 23mm, with a height of only 7.3mm. We’re initially offering through-hole packages, but will be launching SMD variants in the future.

When will the product be available?

The new BCM in the ChiP package is on general sale today.


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2 Responses to:
Vicor Launches First Product in Revolutionary ChiP Package

  1. Valeriy on January 19, 2014 at 4:43 AM

    Dear friends, where can I buy samples of this modules?

    • Webmaster on January 20, 2014 at 10:27 AM

      Samples can be bought online. Alternatively, you can contact the Russian team on +49 89 962 439 0 or at They’d be please to discuss your requirements in more detail.

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