Power Electronics Europe Features the Thermal Performance of Vicor’s ChiP Technology

November 6, 2013

No matter how efficiently your subsystem delivers energy, the residual dissipation and your ability to remove heat from the system limits power density.

power-electronics-europe-coverWaste energy, in the form of heat, is the enemy of power system designers. Although converter technology continues to increase efficiency, particularly components based upon Vicor’s Sine Amplitude Converter (SAC), there will always be some waste heat that needs to be removed.

Power Electronics Europe features an article by Gary Gill, Vicor’s Director V.I Chip Product Line, which defines the problem, explaining that heat is typically the factor that limits power density. In this article, Gary describes some of the tools, including our PowerBench simulator, that can be used to calculate the wasted energy that must be removed as heat.

Heat can be removed by conduction or convection: a key factor determining the efficiency of this process is the thermal performance of the power component’s packaging. Gary explains in the article some of the ways that packages can improve conduction and describes the new Vicor ChiP packaging, which enables two-sided cooling and offers exceptional thermal performance.

Power Electronics Europe has made the article available for everyone. Every power system designer should be interested in how to improve their thermal design, and will want to read “New Thermal Design Options Drive Power Density”.

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