Arthur Russell to Present at IEEC 2013 Electronics Packaging Symposium

October 9, 2013


Arthur Russell, VI Chip Factory Applications Engineer at Vicor, will present a paper at the upcoming 2013 Electronics Packaging Symposium, which will be held at Binghamton University in Binghamton, NY, USA. This event is organised by the Integrated Electronics Engineering Center (IEEC) at Binghampton University, which is part of The New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3iP).

Arthur will present a paper entitled, 3-D ChiP Packaging & Cooling Enables Advances in High Power DC-DC Conversion on Tuesday 15th October at 2:30pm. Attendees will be able to learn about the benefits of Vicor’s forthcoming ChiP packaging technology and how it helps increase power density whilst optimising thermal performance. The agenda includes other speakers such as experts from Microsoft, Lockheed Martin and GE, as well as many leading academics.

The event is held in conjunction with GE Global Research Center and Binghamton Chapter of the IEEE Components, Packaging and Manufacturing Technology Society (CPMT).

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