Video interview presenting ChiP packaging technology

July 1, 2013
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Claudio Tuozzolo introduces Vicor’s ChiP (Converter Housed in Package) packaging technology to ‘Electronic Design Europe’ editor, Paul Whytock, at the PCIM show in Nuremberg, Germany.  This scalable technology breaks new barriers for performance and design flexibility for power components and has already demonstrated a 2x increase in power density.

Watch the video interview from Engineering TV and learn more.

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Further links:

American Technology Award Win for ChiP Technology

Vicor’s Converter housed in Package (ChiP) Technology

Video: An Introduction to ChiP Technology

 

 

 

 

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