High Efficiency Power Solutions at COMPUTEX TAIPEI 2013

May 16, 2013
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COMPUTEX TAIPEI has become the largest computer exhibition in Asia and the second largest in the world, next to CeBIT in Germany. Each year, global technology companies come to this event to launch new products. As a large portion of the industry has research and deployment centers or production facilities in Taiwan, this exhibition attracts many people, from designers to corporate management, engineers to analysts and journalists, who want to keep abreast of the latest technologies, developments and trends.

This year, Vicor will be exhibiting at the show in partnership with Mitsutech International Corporation at Hall 3, Booth G0330 from June 4 to Jun 8. We are presenting the low profile integrated PFC AC Front End Module, the award-winning (EDN magazine’s Hot 100 Products for 2012) ZVS Buck Regulator product portfolio, and the newly-launched Cool-Power Isolated DC-DC converters.

We will also unveil, for the first time in Taiwan, our new Converter housed in Package (ChiP) power component packaging technology. With the industry so focused on improvements in efficiency and reductions in size, there will be particular interest in the ChiP packaging technology’s ability to enable a new generation of power components. Especially when these components can provide a staggering 4X increase in power density and 20% reduction in power loss versus earlier generation components, equipping customers to achieve previously unattainable system size, weight and power efficiency targets.

Come and visit us to discuss contemporary onboard power distribution face to face with Vicor.

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