Power Components Come of Age

Vicor’s CEO, Dr. Patrizio Vinciarelli gave a keynote presentation at APEC which plots the advances made in power electronics over the past 30 years.  Dr. Vinciarelli proposed a solution that will take the industry to the next level of power density for designers using a power component methodology.

Gone are the days of being able to power equipment with centralized boxes; loads now require multiple voltage rails, tight regulation requirements, and fast transient response.

The power conversion system now needs to be inside and alongside the equipment within the system and the power system concurrently. Power components have to be efficient, to minimize self-heating and simplify thermal management; small to be located near the load and supply decreasing logic voltages at ever increasing currents – and flexible to meet varied mechanical and thermal requirements. They have to be scalable to meet a broad range of loads with modules having the requisite high density and cost effective when compared against custom power supply alternatives.

Vicor’s newly launched power component technology, “Converter housed in a Package” (ChiP), has the necessary performance and cost attributes to bring the power component revolution to fruition – utilizing integrated magnetic structures penetrating through a high density interconnect substrate with symmetrically two-sided layout to essentially double power density. ChiP technology already supports packages as thin as 4.7mm in ChiP sizes ranging from 1323 to 6123 with current capability up to 180A, voltage capability up 430V and power capability up to 1.5kW. With an expanding array of package sizes, voltage capability up to 800V and power capability up to 4kW per ChiP are possible.  In time, ChiP technology will support even greater levels of performance.



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3 Responses to:
Power Components Come of Age

  1. […] showing the latest packaging technology, which our CEO, Patrizio Vinciarelli, discussed during his keynote speech at APEC last month.  This breakthrough ChiP (Converter housed in Package) technology will enable us […]

  2. Charles G. Nutter on April 12, 2013 at 10:41 PM

    It was nice to see the exhaustive use of planar and toroidal magnetic components with Synchronous rectification using low drop transistors.

    Power factor correction of high voltage AC fed to a CHiP reduces reliability if electrolytic capacitors are used so those capacitors must be eliminated or secret new capacitors created. Switching frequencies must be very very high to hold down magnetic component size and filter capacitors, too, so skin effect losses in the magnetic parts, circuit traces, and magnet material and capacitor material third order tensor losses must be solved. Where will these magic parts come from. Vicor must be making many of the special parts that allow very high switching rates. This raises R&D budgets. Applied to LED lighting we need to be first with novelty and low in cost to appeal to the LED lighting market at high lumen output levels. Can costs really come down to make this happen. Put it this way; could CHiP’s be made to drive 160 Watt LED load at price under 45$. This would be a typical load for many commercial concerns, say eliminating a fluorescent fixture using 20K lumens of LEDs for wide area light sources. Remember, we want PFC at .98, 95% efficiency, at 277V input. We will take all I can get if Vicor do this… and so will everyone else. Do it!

  3. Charles G. Nutter on April 12, 2013 at 9:55 PM

    The video points every engineers dream solution wished for for many years. It seems that the rectifiers are the limiting component. They seem to need 1 volt to turn on and operate at full current. Conducted and emitted radiation is another headache when putting power CHiP technology neat sensitive sensors. But, we need CHiP now more than ever before. We plan to use it extensively in LED lighting solutions.


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