New V•I Chip™ Through-Hole Packaging Option

January 7, 2008

Vicor has added a through-hole packaging option for all V•I Chip products. This is in addition to existing surface mount (SMT) compatible packaging, doubling the available range. This new option allows power designers in a broader range of applications to take advantage of the benefits of V•I Chips.

Through-hole products are electrically and thermally identical to the SMT versions and are compatible with both hand soldering and wave solder techniques so they are perfect for fast prototyping or large production runs. Through-hole assembly facilitates multi-chip cold-plate or heatsink mounting and makes system assembly simpler, faster, and cheaper.

The new through-hole packaging option is compatible with both leaded and lead-free solder.

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