New Off-line, High-density V•I Chip™ Bus Converter

October 15, 2007

Vicor has launched a high-voltage V•I Chip bus converter with a power density of greater than 1000 W/in³ (part number B384F120T30). This BCM™ module is a high-efficiency (>95%), Sine Amplitude Converter™ (SAC) operating from a 360-400 Vdc (384 Vnominal) primary bus to deliver an isolated low voltage secondary.

The 12 V (nominal) output can be paralleled for high current outputs or connected in series to create a 48 Vbus, making the converter ideal for use in high performance server and telecom ac-dc SMPS and enabling major power density improvements in the post-PFC dc-dc stage. The BCM converter may also be used in high-power, high-efficiency data center applications to power individual cards or blades directly from the HV distribution bus.

The V•I Chip package – measuring just 32.5 x 22 x 6.6 mm – is compatible with standard pick-and-place surface-mount machinery and assembly processes. It provides flexible thermal management through its low junction-to-case and junction-to-board thermal resistance. The low impedance of the BCM converter enables POL capacitance minimisation or elimination while the positive temperature coefficient of the output means that converters share simply and reliably with no interconnect circuitry; all resulting in savings of board area, materials, and total system cost.

New 1.2 kW demo boards are now available to enable designers to experience the high performance and flexibility of the 300 W BCM converters in many application systems.

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